Role Overview:
We are seeking an experienced IC Packaging Engineer to drive next-generation package architecture, design, and productization using advanced node silicon (7nm, 5nm, 3nm and beyond). This role partners closely with chip design, system design, SI/PI, thermal, and manufacturing teams to define and deliver industry-leading package solutions. The ideal candidate has deep technical expertise in substrate design, floor-planning, bump architecture, advanced materials, and HVM execution.

Key Responsibilities:
Package Architecture, Co-Design & Optimization
Collaborate with chip design and analog/digital IP/PHY teams (224G/112G SerDes, PCIe Gen 6/7, ADC/DAC, etc.) to optimize chip floorplan, die bump patterns, and IO architecture for advanced node products.
Co-optimize package stack-up, layer count, escape routing, BGA pattern, and power integrity architecture aligned to system and manufacturing requirements.
Interpret SI/PI parameters (RL, IL, NEXT/FEXT, etc.) to drive signal integrity optimization.

Package Design & Integration:
Work with IC design, system engineering, SI/PI, and thermal teams to perform BGA substrate design using Cadence APD or equivalent tools.
Ensure package designs meet SI/PI, mechanical, high-power thermal and reliability targets.
Define and refine assembly BOM, process flows, and design rules for advanced packaging technologies.
Define POR for new silicon nodes including bump metallization, geometry, and process requirements.
Drive implementation, optimization, and HVM qualification of new package / assembly technologies.

Program Management & Cross-Functional Execution:
Own packaging deliverables from concept through substrate design, development, qualification, and high-volume manufacturing.
Lead interactions with assembly, substrate, and manufacturing partners for NPI bring-up and production ramp.
Provide sustaining support during HVM, including multi-source enablement.
Work closely with QA, product/test engineering, and customer teams to diagnose and resolve quality, reliability, or manufacturing issues.

Required Qualifications:
Bachelors and 8+ years or Masters degree and 6+ years or PhD and 3+ years of related experience;
BS/MS/PhD in Electrical Engineering (Preferred), Mechanical Engineering, Materials Science, or related field.
Extensive hands-on experience in advanced IC packaging for advanced silicon nodes.
Expertise in substrate design, SI/PI principles, thermal management, and high-speed IO packaging.
Strong understanding of high layer count, large body, flip chip BGA packaging technology
Proficiency in Cadence Allegro APD/SIP or comparable packaging design tools.
Experience working with global OSATs and substrate suppliers.
Proven ability to drive NPI through HVM with strong cross-functional leadership.
Excellent communication, documentation, and customer-facing skills.

IC Package Design / Development