Process Engineer

Sedgefield | Permanent | Up to £65,000 DOE

An exciting opportunity for a Process Engineer to join a growing high-technology manufacturing team, supporting the development and introduction of advanced RF and microwave products into production.

The role will focus on developing and optimising semiconductor and RF assembly processes, particularly die attach and gold wire bonding, while driving yield, quality and process improvements.

Key Responsibilities

Develop and optimise die attach and wire bonding processes
Support NPI, DFM/DFA and process validation
Improve manufacturing yield, reliability and efficiency
Carry out process trials, root cause analysis and continuous improvement
Develop and document manufacturing processes and control plans
Work closely with Engineering, Quality and Production teams

Requirements

Degree in Engineering, Materials Science, Physics or similar
Experience in semiconductor, RF, electronics or high-precision manufacturing
Hands-on experience with silver epoxy, silver sinter, eutectic die attach or gold wire bonding
Strong understanding of manufacturing processes and statistical analysis
Excellent problem-solving skills and a hands-on approach

Experience in automotive electronics, power electronics, RF manufacturing or contract manufacturing would be highly desirable.

Salary: Up to £65,000 DOE

Interested? Send your CV to gcook@octagongroup.co.uk.